What is the relationship between the data writing time and production capacity of the device?_copy20251120

Generally speaking, if the data writing time is longer, the production capacity will relatively decrease, and there is an inverse relationship between the two. Taking PTA-8500A as an example, the relationship between data writing time and production capacity is as follows: Capacity table IC write capacity table (Unit: sheets/hour) Configuration Personalized time(s) 17 18 20 25 35 40 32 card writing station 6000 5700 5200 4200 3000 2700 Configuration Personalized time(s) 9 10 12 15 18 20 16 card writing station 5650 4800 4100 3300 2800 2500 High speed laser marking capacity table (Unit: sheets/hour) Configuration Personalized time(s) 1 1.4 1.6 1.8 2 2.2 High speed laser marking 6000 4500 4100 3700 3300 2900 Note: Capacity is calculated based on the number of cards.

What are the benefits to users of the flexible performance demonstrated by the PFL series of devices?_copy20251120

Customers can choose to configure functional units such as magnetic writing, contact IC writing, non-contact IC writing, flat printing, embossing, hot stamping, visual verification&contact IC verification&non-contact IC verification, and visual detection according to their own needs, as well as the number of configurations for each unit. If all functions are combined together, the entire production line will occupy a smaller area and be easier to maintain. Under the same footprint, there are more configurable modules, resulting in higher production capacity.

How long does it take for PTM-120T equipment to switch between different stripe module specifications?_copy20251120

The company adopts a unique chip type fast switching patented technology: without the need to plug and unplug cables, it can achieve fast switching of 6pin and 8pin production tasks within 60s, greatly improving the efficiency of order conversion.

Smart Card Personalization Machine

Smart Card Chip Module Assembly & Test

Types

PTM-120T Chip Module Initialization and Testing Machine

PTCME302 Chip Module Encapsulation Machine

Chip bonding functions: smart card chip placement, dispensing quality inspection, visual automatic chip alignment and automatic detection of placement accuracy, silver glue thermal curing, base material bad material detection and identification

Wire bonding functions: As a semiconductor chip making company, Piotec's smart card chip bonding, constant temperature control welding head, solder joint accuracy correction

Glue coating and sealing functions: incoming material detection, glue coating, visual positioning, UV curing, thickness measurement, gun waste

Initial data writing and detection functions: data writing, gun scrapping, and broken ribs.

Parameter of Smart Card Personalization and Issuing Machine_copy20251120

Item	Machine name	Capacity	Overall dimensions	Weight	Power supply	Compressed air
1	PTA8500A	6000uph	3600mm×910mm×1900mm	800kg	220V （-5%~+10%） 50Hz 6KW	Pressure: 0.5Mpa Flow rate: 400L/min
2	PTA8500C	2500uph	3850mm×910mm×1900mm	1000kg	220V （-5%~+10%） 50Hz 6KW	Pressure: 0.5Mpa Flow rate: 400L/min
3	FPL3000	2000uph	4470mm×650mm×1450mm	1100kg	220V （-5%~+10%） 50Hz 6KW	Pressure: 0.5Mpa Flow rate: 350L/min
4	FPL6061	2000uph	6500mm×900mm×1900mm	900kg	220V(-5%~+10%) 50Hz 7.5KW
5	FPL6052	2000uph	6500mm×900mm×1900mm	900kg	220V(-5%~+10%) 50Hz 7.5KW
6	PTM120T	60,000 UPH (including broken reinforcement units);	4750mm×840mm×1960mm (including broken reinforcement units);	800kg (including broken reinforcement units);	220V (-5%~+10%) 50Hz 4KW (including broken reinforcement unit);	No air source required
7	PTCME302	120,000UPH (6PIN, excluding broken reinforcement unit	3800mm×840mm×1960mm (excluding broken reinforcement units)	650kg (excluding broken reinforcement units)	220V (-5%~+10%) 50Hz 2KW (excluding broken reinforcement units)	Pressure: 0.5Mpa Flow rate: 1500L/min
8	PTE-S5000	5000UPH	2700mm×1250mm×1300mm	750kg	220V （-5%~+10%） 50Hz 6KW	Pressure: 0.5Mpa Flow rate: 400L/min
Noise：＜65dB; Working temperature：23℃±3℃; Working humidity：50±10%

Personalized Identification Process for FPL3000 Banking Card Personalization Machine_copy20251120

There are many personalized identification processes for FPL3000, includingThermal Printing, DOD Inkjet，Laser Engraving，Embossing and Indenting，Topping Module，etc.

Thermal Printing Module:

Monochrome thermal printing modules with resolution of 300DPI, more modules can be added on requirements.
Image formats such as BMP, GIF, TIFF, PGN are available.
Capable of detecting color ribbon breakage; Color ribbon remaining quantity alarm function.

DOD Inkjet Module:

DOD inkjet module including 1 plasma unit , 1 DOD inkjet system, and 1 UV curing unit.
1 more set of DOD module is extensible which makes double-sided speed up to 6000UPH.
Black/white monochrome inkjet is supported and YMCK color inkjet is optional, maximum resolution is up to 1200DPI.
Dual-side printing is supported. Single -sided printing speed is 6000UPH and double -sided printing speed is 3000UPH.

Laser Engraving Module:

20W fiber laser and extractor.
Equipped with 1 smoke purifier.
Characters (including Micro-text), bar codes, QR codes, machine readable codes, CLI/MLI, braille and high-quality gray images can be engraved on the front and back of the card with a resolution of maximum 1600DPI.

Embossing and Indenting Module:

Support embossing and indenting character printing. Support indenting character printing on both sides
Character Plate Capacity: up to 120 characters.
The Character nails complies with the ISO standard for international credit card specific characters.
Capable of detecting indenting character color ribbon breakage; indenting character Color ribbon remaining quantity alarm function.

Topping Module: