Semiconductor Chip Manufacturing

This solution is mainly aimed at the back-end processes of semiconductor manufacturing, including sorting and cutting, dicing, thinning and peeling, thinning and tearing, wire bonding (DIE-BONDER, WIRE BONDER), etc. Various types of customized and flexible equipment can be provided according to customer needs. For new products, more suitable processing technology solutions can be quickly sorted out, allowing customers to put them into mass production as soon as possible.

This solution is aimed at smart card IC module testing and packaging factories, and can provide decoration, layout, standard and process construction, personnel training, etc. The process provided by this solution mainly includes chip fixing, wire bonding and glue coating for smart card IC modules, as well as initialization data writing and detection. For the chip fixing and welding process, this plan provides two options: new equipment and second-hand equipment based on customer investment costs.