The MIL2000 Fully Automatic Multifunctional INLAY Line is designed for manufacturing INLAY products of secure documents such as e-passports (ID-3), ID cards (ID-1) and other contactless smart cards. With sheet materials as the processing carrier, it integrates the core processes of chip module mounting, antenna embedding, welding and inline testing. It supports two module fixing solutions of vacuum chucking and adhesive dispensing, enabling the integrated and fully automated production of INLAY products.
Automatic material feeding by robotic manipulator, equipped with static eliminator
Hopper height 150mm, max. material size 650mm×400mm
Double-sided cleaning in one pass
Ensures a 98% cleanliness rate for surface cleanliness
Cylinder-driven die, compatible with mainstream chips
Supports visual inspection, margin warning and automatic defect marking.
High-speed & high-precision pickup head which transfers modules from the strip to the transfer stations with angle rotation function
4 transfer stations and 4 pickup heads for continuous operation
Equipped with 2 sets of working platforms to realize alternate operation
Supports both dispensing and vacuum adorption
8 ultrasonic embedding heads, position & spacing adjustable
Antenna recipe storage, parameter adjustable via software
4 hot-press welding units, 90° angle adjustable
Equipped with precision wire cutting blades, with automatic wire cutting
Optional vision for welding quality
100% inline inspection for antenna electrical performance, resonant frequency, Q value, and gain
Automatic UID collection and management, laser marking for rejects
Dedicated hopper for marked rejects
Hopper height 50mm
Automatic unloading by robotic manipulator, equipped with static eliminator
Hopper height 150mm
| Material Configurations | |
| Sheet Substrate | Type： PVC, PC, PETG, Teslin; Thickness：0.1mm-0.25mm |
| Copper Wire | Enameled copper wire Diameter：0.08mm-0.12mm |
| Chip Module | Compatible with mainstream chip types，e.g., MOA2, MOA4, MOB6, MOA8 |
| Equipment Technical Specifications | |
| Dimensions | 6500（L）×1350（W）×1800（H）mm |
| Power Supply | 220V(-5%～+10%), 50Hz，7KW |
| Operating Environment | Temperature: 23℃ ± 3℃, Humidity: 50% ± 10% |
| Layout | Compatible with 3×8, 4×8, 6×8 layouts |
| Throughput | 6×8 layout: 2800 coils/hour (4 turns, 8 winding heads). Dependent on winding time |
Highly integrated with chip mounting, antenna embedding, welding and inline inspection. Supports both vacuum and dispensing processes to realize fully automatic INLAY production on a single machine.
High-precision pick-and-place and ultrasonic embedding, with precise control over the entire process. Parameters are adjustable via software to ensure product consistency and stability.
100% inline inspection with UID collection and reject marking. CE certified, equipped with safety light curtains and authority management for safer production.
Compatibility with various materials and mainstream chips.Ssupports multi-size layouts, and features dual-platform alternating operation for stable running and quick changeover.
Fully automatic operation reduces labor and equipment costs, with low material waste and easy operation, providing a cost-effective solution for high-volume card production.
Contact Piotec for Smart Card Solution
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