What is the relationship between the data writing time and production capacity of the device?_copy20251120

Generally speaking, if the data writing time is longer, the production capacity will relatively decrease, and there is an inverse relationship between the two. Taking PTA-8500A as an example, the relationship between data writing time and production capacity is as follows: Capacity table IC write capacity table (Unit: sheets/hour) Configuration Personalized time(s) 17 18 20 25 35 40 32 card writing station 6000 5700 5200 4200 3000 2700 Configuration Personalized time(s) 9 10 12 15 18 20 16 card writing station 5650 4800 4100 3300 2800 2500 High speed laser marking capacity table (Unit: sheets/hour) Configuration Personalized time(s) 1 1.4 1.6 1.8 2 2.2 High speed laser marking 6000 4500 4100 3700 3300 2900 Note: Capacity is calculated based on the number of cards.

What are the benefits to users of the flexible performance demonstrated by the PFL series of devices?_copy20251120

Customers can choose to configure functional units such as magnetic writing, contact IC writing, non-contact IC writing, flat printing, embossing, hot stamping, visual verification&contact IC verification&non-contact IC verification, and visual detection according to their own needs, as well as the number of configurations for each unit. If all functions are combined together, the entire production line will occupy a smaller area and be easier to maintain. Under the same footprint, there are more configurable modules, resulting in higher production capacity.

How long does it take for PTM-120T equipment to switch between different stripe module specifications?_copy20251120

The company adopts a unique chip type fast switching patented technology: without the need to plug and unplug cables, it can achieve fast switching of 6pin and 8pin production tasks within 60s, greatly improving the efficiency of order conversion.

Smart Card Personalization Machine

Smart Card Chip Module Assembly & Test

Types

PTM-120T Chip Module Initialization and Testing Machine

PTCME302 Chip Module Encapsulation Machine

Chip bonding functions: smart card chip placement, dispensing quality inspection, visual automatic chip alignment and automatic detection of placement accuracy, silver glue thermal curing, base material bad material detection and identification

Wire bonding functions: As a semiconductor chip making company, Piotec's smart card chip bonding, constant temperature control welding head, solder joint accuracy correction

Glue coating and sealing functions: incoming material detection, glue coating, visual positioning, UV curing, thickness measurement, gun waste

Initial data writing and detection functions: data writing, gun scrapping, and broken ribs.