The M2M Chip Personalization Machine SCM4000 can conduct chip electrical performance test, chip encoding, and surface laser marking for M2M chips in QFN, DFN, BGA, and other packaging forms, automotive electronic SE (Security Element), eSIM, and other smart devices.
SCM4000 can provide high-speed, stable, and safe personalization production services for global mobile operators, smart device OEMs, and automotive electronic security chip manufacturers.
1. Tray Input: up to 20pcs of trays can be loaded；
2. Tape Input: tape in 12mm is supported, 8mm, 16mm, and 24mm are extensible.
3. Compatible with tape rolls in 180mm and 330mm.
1. Equipped with 2 chip storage stations.
2. The chip direction can be automatically adjusted by forward & reverse 90°.
3. 180° rotations by identifying the mark point on the chip.
4. Optional Mark Point Visual Identification.
1. Standard configuration: 32 perso stations with 8pcs of PIOTEC 4IN1 contact readers PT204PT-AMA.
2. Chip encoding and remaking online is supported. ISO7816,
3. ISO7816, Optional multi-protocol reader, SPI, and I2C protocols are supported.
1. Equipped with 1 set of 20W fiber laser, surface information in 2 chips can be marked at the same time.
2. Equipped with a set of 5 million pixel industrial camera，2 chips can be identified and verified at the same time. In online mode, the engraved information on the chip surface is displayed in real time.
3. Equipped with 1 set of extractors. Module： FC300I.
Equipped with 4 verification stations with 1pcs of PIOTEC contact reader PT204PT-AMA.
| Overall Dimension | 2000mm×1100mm×1800mm |
| Weight | 600kg |
| Power Supply | 220V(-5%~+10%), 50Hz, 3KW |
| Noise | ＜65dB |
| Operating Temperature | 23℃±3℃ |
| Operation Humidity | 50±10% |
| Compressed Air | 300LPM |
Rejecting rate is less than 1/1000.
Downtime for 100-hour failure is not exceed 30 minutes.
High-precision of mechanical carrying mechanism can handle chips down to 2*2mm.
Dozens of chips in different forms and specifications can be supported, and the switching time is less than 20 minutes.
Compatible with both tray and tape for input， and compatible with tape output.
Secondary development is fully supported to meet a range of customized requirements.
The instant production capacity can reach 4500 chips/hour.
The throughput can reach 2,000,000 chips/month.
The customer procurement costs can be reduced by 15% due to the variety of self-developed core technologies integrated.
The maintenance costs can be reduced by 20% with less wear and longer service life.
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