Semiconductor Chip Manufacturing

This solution is mainly aimed at the back-end processes of semiconductor manufacturing, including sorting and cutting, dicing, thinning and peeling, thinning and tearing, wire bonding (DIE-BONDER, WIRE BONDER), etc. Various types of customized and flexible equipment can be provided according to customer needs. For new products, more suitable processing technology solutions can be quickly sorted out, allowing customers to put them into mass production as soon as possible.

We provide turnkey IC module testing solutions for smart card manufacturing, covering equipment integration, production line configuration, intelligent manufacturing systems, and complete technical services. Designed for high efficiency and stable performance, the solution supports scalable production capacity, flexible configurations, and reliable quality control, helping manufacturers quickly build or upgrade smart card IC module testing factories while improving production efficiency and reducing operational costs.