The M2M Chip Personalization Machine can conduct chip electrical performance test, chip encoding and surface laser marking for M2M chips in QFN, DFN, VSOP8 and other packaging forms, automotive electronic SE (Security Element), eSIM and other smart devices.
SCM can provide high-speed, stable, and safe personalization production services for global mobile operators, smart device OEMs, and automotive electronic security chip manufacturers. Since 2017, the chip manufacturing equipment we have provided to dozens of factories has produced nearly 500 million chips, reflecting our commitment to providing customers with high-quality solutions.
| Item | Machine name | Capacity | Overall dimensions | Weight | Power supply | Compressed Air |
| 1 | SCM3000 | 2500/uph | 1850mm X 1600mm X 1750mm | 600kg | 220V(-5%~+10%,50Hz,6KW | Pressure:0.5Mpa Flow rate:300LPM |
| 2 | SCM200 | 1000/uph | 1250mm×950mm×1870mm | 450Kg | 220V(-5%~+10%), 50Hz, 3KW | |
| 3 | DPC500 | 500/uph | 1210mm×930mm×1880mm | 500kg | AC220V(-5%~+10%), 50Hz, 0.5kW | |
| Noise: <65dB; Working temperature:23℃±3℃;Working humidity:50±10% | ||||||
Surface information of chips can be recognized and verified.
What is the downtime for equipment failure?
Hundred-hour downtime should not exceed 30 minutes.
How long does it take to switch between different specifications of chip production?
The switch only takes 20 minutes.
Which core components on the equipment are independently developed and produced by the company?
The 4-piece 4-in-1 contact reader PT204PT-AMA on the IC writing unit is independently developed and produced by Pelteco The dedicated laser marking machine of the laser marking unit is independently developed and produced by Pelteco, which can carry out laser marking of surface personalized information on 2 chips at the same time to improve the marking efficiency The configuration of the Visual verification Unit (OCR) 1 set of visual recognition system is independently developed and produced by Pelteco.
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